3D-Micromac Clean room

Applications

In our application and service center, we offer the development of customized laser processes for the industrial production as well as laser contract manufacturing of parts with small to large batch sizes.

Based on our long-term experience of several decades in the field of laser micro machining we are able to offer a large variety of applications.

These include:

  • Separating, drilling, structuring of glass wafers and panels with different glass materials
  • Processing of optical devices
  • Generation of micro fluidic channels for medical, biological, chemical applications in glass, metal or ceramic materials
  • Laser Lift-Off (LLO) of glass and sapphire substrates for the semiconductor industry, as well as for production of organic light-emitting diodes (OLEDs) and microLED-displays
  • Laser-Lift-Off (LLO) of flexible electronic systems based on transparent glass substrates
  • Laser processing of flexible electrical systems, e.g. in the field of medical devices and sensors using roll-to-roll procedures in our microFLEX® system
  • Fabrication of micro drillings for fluidic applications, e.g. inkjet printing nozzles, micro filters with drilling diameters of only a few micron and with defined hole geometries
  • Cutting, drilling, structuring of polymers and polymer composites for sensor and medical technology
  • Laser supported sample preparation of specimens for diagnostics of microstructures and failure analysis
  • Separation of semiconductor wafers and solar cells by TLS-dicing technology with our microDICE® system

Convince yourself of our high performance quality by having a look at our sample gallery!

You cannot find your preferred application?

Our core competence is the development of solution-oriented applications on the highest technological standard. We are able to find the most efficient solution for you.

Please contact us!

Contact
Laser cutting of glass (B33), thickness 1mm Laser cutting of glass (B33), thickness 1mm
Laser cutting of glass (B33), thickness 1mm Laser ablation of a gold coating from polymer for sensor technology Laser drilling of an inkjet printing nozzle in PI Laser drilling in sapphire Laser drilling in sapphire Laser drilling for inkjet printing nozzles in stainless steel Laser ablation of pyramids in SiC Selective removal of an ITO layer from PET using an ultra-short pulse laser Selective laser ablation of an ITO layer on glass SiC die - separated using TLS-Dicing Laser ablation of an XL chunk in silicon for sample preparation Thinning of silicon to 12 µm in preparation for a TEM lamella Surface removal of a gold coating from Al2O3 ceramic Laser cutting of a honeycomb structure Laser ablation of glass using FSLA technology Laser structuring of glass using FSLA technology Ablation of a cavity in glass using FSLA technology Laser drilling in molybdenum, material thickness 50 µm Generation of microfluidic channels in glass using FSLA technology Laser fine structuring of brass Laser fine structuring of brass Laser marking in silicon